Failure Analysis
Looking Without Cutting
When failures occur, it can not only be costly, it can be deadly. Pinpointing the root cause of the failure is essential to safeguarding against it happening again. Typical failure analysis can involve serial sectioning the part to observe the microstructure, but this destroys the evidence and may prevent further testing – sometimes even inducing unwanted damage such as micro-cracking, which can be misleading to the investigation. Because μCT does not require the destruction of the sample, it can be used in combination with other analysis techniques for a more comprehensive investigation into the failure mechanism.
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Nondestructive Investigation |
Obtain crucial insights as to where and how the failure occurred. |
| Root Cause Analysis | Compare both known “good” and “bad” samples for a side-by-side assessment. |
| Digital Archiving | Preserve essential information about the sample in a digital format. |
Technische Daten
SKYSCAN 1275 – Voxel size 10 μm
Ansprechpartner
Telefon: +41 44 940 99 33
Dr. Hans-Peter Gut
sales@eyeQ-Instruments.com
+41 44 940 99 33